Mechanical housing

ABSTRACT

An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

This application claims benefit under 35 U.S.C. §119(e) of U.S.Provisional Application Serial No. 60/246,174, filed Nov. 6, 2000, whichis incorporated herein by reference.

CROSS RELATED APPLICATIONS

This application is related to co-pending, application Ser. No.09/804,106 and U.S. Pat. No. D462,675 S entitled CABLE HEAD ASSEMBLY andRADIATING REPEATER CASE, respectively, and filed on even date herewith,which applications are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to the field of environmentallyprotected housings for containing electronic components and, inparticular, to the enhanced cooling of electronic components containedwithin environmentally protected housings.

BACKGROUND

Environmentally protected housings are used in a wide variety ofapplications, including containing and protecting electronic componentsof the type used for transferring signals over long distances. Forexample, the telecommunications industry transfers signals over opticalfibers. If the signal is transferred over a long distance, the signalmay be too weak by the time it reaches its destination to be useful.Consequently, electronic circuit cards are used to detect, clean up, andamplify a weak signal for retransmission through another length offiber-optic cable. These electronic circuit cards are often deployed inenvironmentally protected housings located above and below ground.

Increased demands on the telecommunications industry, such as the adventof High-Bit-Rate Digital Subscriber Lines (HDSL), to meet the increasingneeds of internet subscribers has resulted in the need to transfer moreand stronger electrical signals over greater distances. One way ofaccomplishing this is to amplify the signals using electronic circuitcards deployed in environmentally protected housings. To meet the needfor transferring stronger electrical signals over greater distances,electronic circuit cards having higher amplification capabilities, andthus greater heat dissipation rates, than the last generation of circuitcards of this type may be used. The need for more electrical signals ofthis type may be accommodated by placing as many of thesehigher-heat-dissipating circuit cards into a single environmentallyprotected housing as possible. However, existing housings configured toaccommodate the heat loads of the last generation of electronic circuitcards cannot accommodate the increased heat load of larger numbers ofhigher-heat-dissipation electronic circuit cards.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art forenvironmentally protected housings that can handle the increased heatload associated with increased numbers of higher-heat-dissipationelectronic circuit cards and thereby maintain an acceptable operatingtemperature within the housing.

SUMMARY

The above-mentioned problems with existing housings configured toaccommodate the heat loads of the last generation of electronic circuitcards being unable accommodate the increased heat load of larger numbersof higher-heat-dissipation electronic circuit cards and other problemsare addressed by embodiments of the present invention and will beunderstood by reading and studying the following specification.Embodiments of the present invention provide a housing adapted tocontain objects, for example electronic circuit cards; at least one caselocated within the housing, the case adapted to confine the objects todifferent locations within the housing, the case also thermally coupledto the objects; and at least one heat sink adapted to absorb heat fromthe case, the heat sink thermally coupled to the case and the housing.

More particularly, in a first embodiment, the housing has apartial-shell. The partial-shell has a multitude of fins on itsexterior, an aperture, and a cover adapted to selectively seal theaperture against the weather and a pressure differential. Thepartial-shell has a base adapted to seal the partial-shell against theweather and a pressure differential. The partial-shell and the cover canbe any material having a suitable combination of thermal properties,corrosion resistance, and strength, such as a formulation of aluminum,bronze, and nickel. The base can be any material having a suitablecombination corrosion resistance and strength, such as nylon, plastic,such as ABS, or structural foam.

The case defines an object containment volume within the housing. Thecase has a frame that surrounds the object containment volume. The casehas a first partition that divides the object containment volume twoindividual regions. The case has several second partitions that divideeach region into several sections. Each of the second partitions isthermally coupled to the frame and to the first partition.

Each of the sections is divided into several slots. Each slot containsone of the objects. Each object is either thermally coupled to theframe, a second partition, and the first partition or to two secondpartitions and the first partition. The frame, the first partition, andthe second partitions can be any material having suitable thermalproperties, such as aluminum, copper bronze, brass, or the like.

The case is adapted to selective reconfiguration between operating andnon-operating configurations. The non-operating configuration is definedby the second partitions of one of the regions being displaced relativeto the second partitions of the other region. The operatingconfiguration is defined by the second partitions of one of the regionsbeing aligned with the second partitions of the other region.

At least one heat sink is thermally coupled to the case. The heat sinkis a solid block and can be of any material suitable for heat sinks,such as aluminum, copper bronze, brass, or the like.

The first embodiment has a cage attached to the base. The cage isadapted to confine the case, including at least one heat sink thermallycoupled thereto, to the base. The cage can be of any suitable material,such as plastic. In this configuration at least one heat sink extendsthrough the cage. When the partial-shell is attached to the base withthe cage, having at least one heat sink protruding therethrough,attached thereto, the heat sink protruding therethrough is thermallycoupled to the partial-shell. The base has a lead-out, such as for wiresused to input and output electrical signals to and from the objects. Thelead-out is sealed against the weather and a pressure differential.

In a second embodiment, the housing has a pair of partial-shells. Thepartial shells are mated together to form a single-shell that hasopposing first and second openings. Each of the partial shells has anumber of fins on its exterior. The partial-shells can be of a materialequivalent to that of the partial shell of the first embodiment. Theembodiment includes a case that can be structurally and functionallyequivalent to the case of the first embodiment. The embodiment includesat least one heat sink thermally coupled to the case that can befunctionally equivalent to the heat sink of the first embodiment. Thecase and the heat sink can be of materials equivalent to the case andheat sink of the first embodiment, respectively.

The second embodiment has a cage that contains the case, including atleast one heat sink thermally coupled thereto. The cage has continuousopposing first and second openings. The cage, including the case havingat least one heat sink thermally coupled thereto, is contained betweenthe partial shells, as mated together to form the single-shell. In thisconfiguration, the first opening of the cage coincides with the firstopening of the single shell and the second opening of the cage coincideswith at least a portion of the second opening of the single shell.

The second embodiment has a first cover adapted to selectivelysimultaneously close the first opening in the single-shell and seal thefirst opening of the cage against the weather and a pressuredifferential. The second embodiment has a second cover adapted tosimultaneously close at least a portion of the second opening in thesingle-shell and seal the second opening of the cage against the weatherand a pressure differential.

The first cover can be of the same material as the partial-shells, or asuitable equivalent. The second cover can be the same material as thebase of the first embodiment, or a suitable equivalent. The second coverhas a lead-out, such as for wires used to input and output electricalsignals to and from the objects. The lead-out is sealed against theweather and a pressure differential.

As configured, the cage contains the case so that at least one heat sinkprotrudes through one of its openings and so that the case and theobjects contained therein are sealed against the weather and a pressuredifferential by the first and second covers. When the cage is containedbetween the partial shells, at least one heat sink is thermally coupledto one of the partial shells.

In a third embodiment, the housing has a shell. The interior of theshell is divided into a pair of compartments by a partition. The shellhas a pair of first apertures, one for each compartment. The shell has asecond aperture opposite the first apertures. The shell has a pair offirst covers, each adapted to selectively seal one of the firstapertures against the weather and a pressure differential. The shell hasa second cover adapted to seal the second aperture against the weatherand a pressure differential. The second cover has a lead-out for wires.

The shell also has at least one third aperture located in one of thecompartments between and perpendicular to one of the first apertures andthe second aperture. The shell also has at least one third cover, eachthird cover adapted to seal the third aperture against the weather and apressure differential. The third cover has a number of fins on itsexterior. A portion of the third cover can be thermally coupled to aportion of the shell.

The third embodiment includes at least one case that can be structurallyand functionally equivalent to the case of the first embodiment. Thecase can be of the same material as the case of the first embodiment, ora suitable equivalent. The case is located in the compartment having thethird aperture. The third embodiment includes at least one heat sinkthat can be functionally equivalent to the heat sink of the firstembodiment. The heat sink can be of the same material as the heat sinkof the first embodiment, or a suitable equivalent. The heat sink isthermally coupled to the interior of the third cover and to the case.

In another embodiment, the heat sink includes a phase-change material(PCM) that changes from a solid to a liquid and vice versa. In anotherembodiment, the heat sink includes a PCM that changes from a liquid to avapor and vice versa. In another embodiment, the heat sink includes atleast one heat pipe.

In manufacturing the first embodiment, a partial shell having a numberof fins on its exterior and an aperture is formed. A cover is formed andused to selectively seal the aperture against the weather and a pressuredifferential. A base having a lead-out is formed.

A case adapted to confine the objects to different locations within thehousing is formed. Forming the case involves forming a frame, a firstpartition, and a number of second partitions. The region within theframe is divided into two regions using the first partition, each regionis divided into a number of sections using the second partitions, and anumber of slots is formed in each of the sections. Thermal couplingsbetween each of the second partitions, the frame, and the firstpartition are formed.

Manufacturing the case also involves adapting the case to be selectivelyreconfigured between a non-operating configuration and an operatingconfiguration. The non-operating configuration includes the secondpartitions of one the regions being displaced relative to the secondpartitions of the other region. The operating configuration includes thesecond partitions of one of regions being aligned with the secondpartitions of the other region.

An object, such as an electronic circuit card, is either thermallycoupled to the first partition, frame, and a second partition or to thefirst partition, frame, and two partitions by ensuring the case is inthe non-operating configuration, inserting the object into one of theslots, and selectively reconfiguring the case into the operatingconfiguration. A thermally conducting material, of the type speciallymanufactured for thermal contact situations, can be deployed between themating surfaces of the thermal couplings.

At least one heat sink is formed using a solid block of material. Theheat sink is thermally coupled to one of the frame walls. A cage is alsoformed and used to contain the case, including at least one heat sinkcoupled thereto, so that the heat sink protrudes though the cage.

Manufacturing the first embodiment also involves attaching the cage andits contents to the base, inserting the cage into the partial-shell toform a thermal coupling between at least one heat sink and thepartial-shell, and using the base to seal the partial-shell against theweather and a pressure differential. Also involved is sealing thelead-out in the base against the weather and a pressure differential.

In manufacturing the second embodiment, two partial-shells are formed,each having a number of fins on its exterior. A case that can befunctionally and structurally equivalent to the case of the firstembodiment is formed. At least one heat sink is formed using a solidblock of material and is thermally coupled to the case.

A cage having opposing continuous first and second openings is formedand is used to contain the case, including at least one heat sinkcoupled thereto, so that at least one heat sink protrudes through thecage. The partial-shells are mated together to form a single-shell aboutthe cage that has first and second openings, the first opening beingcoincident with the first opening of the cage and at least a portion ofthe second opening being coincident with the second opening of the cage.Mating the partial-shells about the cage also forms a thermal couplingbetween at least one heat sink and at least one of the partial-shells.

A first cover is formed and is used to selectively simultaneously coverthe first opening in the single-shell and seal the first opening in thecage against the weather and a pressure differential. A second coverhaving a lead-out, such as for wires, is formed and is used tosimultaneously close at least a portion of the second opening in thesingle-shell and seal the second opening of the cage against the weatherand a pressure differential. Sealing the second opening of the cage alsoinvolves sealing the lead-out against the weather and a pressuredifferential. Sealing the first and second openings of the cage alsoseals the case and the objects contained therein against the weather anda pressure differential.

In manufacturing the third embodiment, a shell is formed. The interiorof the shell so formed is divided into a pair of compartments by apartition. The shell so formed has a pair of first apertures, one firstaperture for each compartment, and a second aperture opposite the firstapertures. The shell so formed has at least one third aperture locatedin one compartment between and perpendicular to one of the firstapertures and the second aperture.

At least one case that can be structurally and functionally equivalentto the case of the first embodiment is formed. The case is positioned inthe compartment having the third aperture. A pair of first covers isformed and each is used to selectively seal one of the first aperturesagainst the weather and a pressure differential. A second cover having alead out for wires is formed and used to seal the second aperture.Sealing the second aperture involves sealing the lead-out against theweather and a pressure differential.

At least one heat sink, structurally and functionally equivalent to theheat sink of the first embodiment, is formed. At least one third coveris formed. The third cover so formed has a number of fins on itsexterior and can be of the same material as the partial shell and thecover of the first embodiment, or a suitable equivalent. The third coveris used to seal the third aperture against the weather and a pressuredifferential. The heat sink is thermally coupled to the case and thethird cover. A portion of the third cover can be thermally coupled tothe shell.

In manufacturing another embodiment, a heat sink is formed byconfiguring it to encapsulate a PCM that changes from a solid to aliquid and vice versa. In manufacturing another embodiment, a heat sinkis formed by configuring it to encapsulate a PCM that changes from aliquid to a vapor and vice versa. In manufacturing another embodiment, aheat sink is formed to include at least one heat pipe.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view demonstrating the first embodiment of thepresent invention as assembled.

FIG. 2 is an exploded view demonstrating the first embodiment of thepresent invention.

FIG. 3 is a cross-sectional view demonstrating the operatingconfiguration of the case of the first embodiment of the presentinvention.

FIG. 4 demonstrates the operating configuration of the case of the firstembodiment of the present invention as viewed along 4—4 of FIG. 3.

FIG. 5 is a cross-sectional view demonstrating the non-operatingconfiguration of the case of the first embodiment of the presentinvention.

FIG. 6 demonstrates the non-operating configuration of the case of thefirst embodiment of the present invention as viewed along 6—6 of FIG. 5.

FIG. 7 is a perspective view demonstrating the second embodiment of thepresent invention as assembled.

FIG. 8 is an exploded view demonstrating the second embodiment of thepresent invention.

FIG. 9 is a back elevation view demonstrating the second embodiment ofthe present invention.

FIG. 10 is a perspective view demonstrating the third embodiment of thepresent invention as assembled.

FIG. 11 is an exploded view demonstrating the third embodiment of thepresent invention.

FIG. 11a is cover 306 viewed along 11 a-11 a of FIG. 11.

FIGS. 12, 13, 14, 15, and 16 illustrate an alternative embodiment of acase according to the teachings of the present invention.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that form a part thereof, and in which is shown byway of illustration specific illustrative embodiments in which theinvention may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention, and it is to be understood that other embodiments may beutilized and that logical, mechanical and electrical changes may be madewithout departing from the spirit and scope of the present invention.The following detailed description is, therefore, not to be taken in alimiting sense.

Apparatus 100, shown in FIGS. 1-6, demonstrates a first embodiment ofthe present invention. Apparatus 100 has a housing, demonstrated byhousing 102 in FIG. 1. Housing 102 is adapted to contain objects 104,shown in FIG. 2, such as electronic circuit cards. Apparatus 100 hascase 106 contained within housing 102 that is adapted to confine objects104 to different locations within housing 102, as demonstrated in FIG.2. Case 106 is thermally coupled to each of objects 104. Apparatus 100has at least one heat sink 108 adapted to absorb heat from case 106. Theheat sink is thermally coupled to case 106 and to housing 102. In oneembodiment, two heat sinks, as demonstrated by heat sinks 108 in FIG. 2,are used. In other embodiments, additional heat sinks are employed.

More specifically, housing 102 of apparatus 100 includes partial-shell110, shown in FIGS. 1 and 2. Partial-shell 110 can have a number offins, as exemplified by fin 112 in FIG. 1, distributed on its exterior.Partial-shell 110 has an aperture, which is covered by cover 114, asshown in FIGS. 1 and 2. Both partial-shell 110 and cover 114 can be ofany material having a suitable combination of thermal properties,corrosion resistance, and strength, for example a formulation ofaluminum, bronze, and nickel.

Cover 114 selectively seals housing 102 against the weather and apressure differential. Selective sealing can be accomplished using anysuitable method, for example using cap screws or a combination ofthreaded studs and nuts to compress a suitable gasket, such as a gasketthat seals against the weather and a pressure differential, betweencover 114 and partial-shell 110.

Case 106 has walls 118 and walls 120 that constitute a frame, as shownin FIGS. 2 and 3. Case 106 has several partitions that divide the regionwithin case 106 into a several sections, as exemplified by partition 122and section 124 in FIG. 2. Case 106 also includes partition 126, shownin FIG. 4, that divides the partitioned region within case 106 into twopartitioned regions. Walls 118, walls 120, each partition 122, andpartition 126 can be of any material having suitable thermal andstrength properties, such as aluminum, copper, etc.

FIG. 4 demonstrates that partition 126 divides each wall 120 into twoindividual portions, demonstrated by wall portions 120 a and b for onewall and by wall portions 120 c and d for the other wall. Similarly,partition 126 divides each partition 122 into two portions, e.g.,partitions 122 a, b, and c of FIG. 3 are divided into partition-portions122 aa and 122 ab, 122 ba and 122 bb, and 122 ca and 122 cb,respectively.

Each partition 122 is thermally coupled to the frame by establishingsubstantially void-free contact between each partition 122 and each ofthe walls 118, as demonstrated in FIG. 2 and by partitions 122 a, b, andc of FIG. 3. Each partition 122 is similarly thermally coupled topartition 126, as demonstrated by partition-portions 122 aa, 122 ab, 122ba, 122 bb, 122 ca, and 122 cb in FIG. 4. Substantially void-freecontact can be accomplished using any suitable method, such as bypolishing or disposing a thermally conducting material between themating surfaces of walls 118 and each partition 122 and maintainingforced contact between the mating surfaces using any suitable method,such as by clamping, using a resilient material, by wedging, or thelike. The thermally conducting material can be of the type speciallymanufactured for thermal contact situations such as this.

Each section 124 is divided into several slots, as exemplified by slots128 a and b in FIG. 3. As demonstrated by slot 128 a in FIG. 3, a slotcan include one groove in one of walls 120 and an opposite groove in theneighboring partition, as exemplified by partition 122 a. Asdemonstrated by slot 128 b in FIG. 3, a slot can also include opposingslots in neighboring partitions, as exemplified by partitions 122 b andc. Each slot can contain an object 104, such as an electronic circuitcard. As demonstrated by object 104 a in FIGS. 3 and 4, an object can bethermally coupled to a wall 120, a neighboring partition, as exemplifiedby 122 a, and partition 126. As demonstrated by object 104 b in FIGS. 3and 4, an object can also be thermally coupled to two neighboringpartitions, as exemplified by partitions 122 b and c, and partition 126.

The configuration demonstrated in FIGS. 3 and 4 corresponds to anoperating configuration. The configuration of case 106 can beselectively reconfigured between the operating configuration and anon-operating configuration, demonstrated in FIGS. 5 and 6. Thenon-operating configuration involves a portion, such as wall portion 120a in FIG. 6, of at least one of the walls 120 and alternating partitionportions, demonstrated by partition portion 122 ba, being displacedrelative to the objects, as exemplified by objects 104 a and b. FIG. 6demonstrates that wall portion 120 a is displaced relative to wallportion 120 b and partition-portion 122 ba is displaced relative topartition-portion 122 bb.

Selectively reconfiguring case 106 from the operating to thenon-operating configuration facilitates the insertion and removal ofobjects 104. Selectively reconfiguring case 106 from the non-operatingto the operating configuration secures each object 104 in place to formone of the thermal couplings described above. A thermally conductingmaterial, of the type specially manufactured for thermal contactsituations, can be deployed between the mating surfaces. Selectivelyreconfiguring case 106 from the operating to the non-operatingconfiguration can also involve the other side of partition 126, e.g.,wall portion 120 c and partition-portion 122 bb being displaced relativeto wall portion 120 d and partition-portion 122 ba, respectively.

At least one heat sink 108 is thermally coupled to case 106, but twoheat sinks 108 can be thermally coupled to opposing frame-walls, e.g.,to walls 120, as demonstrated in FIG. 2. Alternatively, at least oneheat sink can be thermally coupled to each of the walls 118 and each ofthe walls 120. Heat sink 108 is a solid block of material having thermalproperties suitable for heat sinks, such as aluminum, copper, brass,bronze, or the like.

A thermal coupling can be established between a heat sink 108 and any ofthe walls of case 106 by brazing or using a thermally conductive epoxy.Polishing the respective contact surfaces or disposing a thermallyconducting material between the respective contact surfaces and screwingthe respective heat sink to the respective wall can also be used toestablish a thermal coupling between a heat sink 108 and any of thewalls of case 106.

Apparatus 100 has cage 130 adapted to contain case 106 therein. Cage 130has openings 132 and openings 133 perpendicular to openings 132, asshown in FIG. 2. Cage 130 has a pair of continuous walls 134. When case106 is contained within cage 130, at least one heat sink 108, asthermally coupled to a respective wall 120 of case 106, protrudesthrough the respective opening 132. In the alternative where each of thewalls 118 of case 106 can also have at least one heat sink 108 thermallycoupled thereto, each of the walls 134 of cage 130 can also haveopenings so that the respective heat sinks 108 protrude through theseopenings. Cage 130 can be of any suitable material, such as plastic.

Apparatus 100 has base 136 adapted to attach cage 130, containing case106 therein, thereto. Base 136 is also adapted to attach partial shell110 thereto. Base 136 can be any material having suitable corrosionresistance and strength, such as nylon, plastic, such as ABS, orstructural foam. In one embodiment, base 136 comprises a cable headassembly constructed as taught and described in co-pending applicationSer. No. 09/804,106 entitled CABLE HEAD ASSEMBLY and filed on even dateherewith, which application is incorporated herein by reference.

Selectively sealing the aperture in partial-shell 110 using cover 114and attaching partial-shell 110 to base 136 closes partial-shell 110 toform housing 102 that contains cage 130, containing case 106 therein. Inthis configuration, at least one heat sink 108 forcibly abuts acorresponding thermally conducting pad, demonstrated by thermallyconducting pad 138 in FIG. 2, that is thermally coupled to the interiorof partial-shell 110. Thermally conducting pad 138 can be of anymaterial having suitable thermal properties, such as aluminum, copper,etc.

Thermal coupling between a thermally conducting pad 138 and a heat sink108 can be enhanced by polishing the respective contact surfaces or bydisposing a thermally conducting material between the respective contactsurfaces. Thermal coupling of thermally conducting pad 138 to theinterior of partial-shell 110 can be accomplished by molding, brazing,or epoxying, using a suitable thermally conductive epoxy. Polishing therespective contact surfaces or disposing a thermally conducting materialbetween them and screwing thermally conducting pad 138 to the interiorof partial-shell 110 can also be used to thermally couple thermallyconducting pad 138 to the interior of partial-shell 110.

Cage 130 can be attached to base 136 using any suitable method, such ascap screws, nuts and bolts, or a threaded-stud-and-nut arrangement. Base136 seals housing 102 against the weather and a pressure differential.Sealing can be accomplished using any suitable sealing method, such ascompressing a gasket between base 136 and partial shell 110. Anysuitable gasket can be used, such as a gasket of type employed by theautomotive industry for engine-head gaskets. The gasket can be siliconeor a suitable equivalent. Compression of the gasket between base 136 andpartial shell 110 can be accomplished using any suitable method, such ascap screws or a threaded-stud-and-nut arrangement.

Base 136 can include lead-out 140, such as for wires used to input andoutput electrical signals to and from objects 104. Lead-out 140 can besealed against the weather and a pressure differential using anysuitable material, such as a suitable elastomer. Apparatus 100 can befitted with a pressure relief valve to guard against excessiveexternal-to-internal pressure differences.

Apparatus 200, shown in FIGS. 7-9, demonstrates a second embodiment ofthe present invention. Apparatus 200 has housing 202, exemplified inFIG. 7 for containing objects, such as electronic circuit cards.Apparatus 200 has a case disposed within housing 202 that is adapted toconfine the objects to different locations within the housing. In oneembodiment, the case is structurally and functionally equivalent to case106 described above and exemplified in FIGS. 2-6 for apparatus 100. Inone embodiment, the case is of the same material as case 106, or asuitable equivalent. Apparatus 200 has at least one heat sink thermallycoupled to the case and to housing 202. In one embodiment, apparatus 200has two heat sinks, as demonstrated by heat sinks 108 in FIG. 2 forapparatus 100, or more. In one embodiment, the heat sink canfunctionally equivalent to heat sink 108. In one embodiment, the heatsink can be of the same material as heat sink 108, or a suitableequivalent.

Apparatus 200 has partial-shells 210 a and b. Partial-shell 210 a hasopposing openings 210 a 1 and a 2 and partial shell 210 b has opposingopenings 210 b 1 and b 2, as shown in FIG. 8. Partial shells 210 a and bhave a number of fins, demonstrated by fins 212 a and b, respectively,on their exteriors. Partial-shells 210 a can be of any material having asuitable combination of thermal properties, corrosion resistance, andstrength, for example a formulation of aluminum, bronze, and nickel.

Apparatus 200 has cage 230 adapted to contain the case, including atleast one heat sink. The heat sink protrudes through one of the openings232, shown in FIG. 8, of cage 230, but an additional heat sink canprotrude through the other opening 232. Cage 230 can include flange 230a that frames opening 230 b, an opening opposite opening 230 b that isframed by flange 230 c, and a pair of walls, as demonstrated by walls234 in FIG. 8. Each of the walls 234 can have openings therein so thatadditional heat sinks thermally coupled to the case can protrudetherethrough. Cage 230 can be of plastic or a suitable equivalent.

Partial-shells 210 a and b are butted together to form a single-shellabout cage 230 that has opposing first and second openings comprisingopenings 210 a 1 and b 1 and 210 a 2 and b 2, respectively. The firstand second openings are coincident with opening 230 b and the openingframed by flange 230 c, respectively. When partial-shells 210 a and bare butted together, the abutment can be sealed against the weather andpressure differential using a suitable material. The sealing materialcan be of a thermal conductivity sufficient to thermally couplepartial-shells 210 a and b. Cap screws, nuts and bolts, athreaded-stud-and-nut arrangement, or a suitable equivalent can be usedto compress the sealing material between partial-shells 210 a and b andto hold partial-shells 210 a and b together.

When partial-shells 210 a and b are butted together to form asingle-shell about cage 230, at least one heat sink protruding throughan opening 232 in cage 230 can abut a corresponding thermally conductingpad 238, shown in FIG. 8. Thermally conducting pad 238 can be of anymaterial having suitable thermal properties, such as aluminum, copper,etc. There can be at least one thermally conducting pad 238 thermallycoupled to partial shells 210 a and b, respectively.

Thermal coupling of thermally conducting pad 238 to partial-shells 210 aand b can be accomplished by molding, brazing, or epoxying, using asuitable thermally conductive epoxy. Polishing the respective contactsurfaces or disposing a thermally conducting material between them andscrewing thermally conducting pad 238 to partial-shells 210 a and b canalso be used to thermally couple thermally conducting pad 238 to theinterior of partial-shells 210 a and b.

Apparatus 200 has cover 214 that simultaneously selectively covers thefirst opening in the single-shell and seals opening 230 b of cage 230against the weather and a pressure differential. Cover 214 can be of anymaterial having a suitable combination of thermal properties, corrosionresistance, and strength, for example a formulation of aluminum, bronze,and nickel. Selective sealing of opening 230 b, using cover 214, can beaccomplished by compressing a suitable gasket, such as a gasket thatseals against the weather and a pressure differential, between cover 214and flange 230 a of cage 230, but two gaskets, as demonstrated bygaskets 231 a and b in FIG. 8, can be used. Any suitable method can beused to compress the gasket between cover 214 and flange 230 a, such ascap screws or a threaded-stud-and-nut arrangement. Gaskets 231 a and bcan be of any suitable material, such as silicone, rubber, or the like.

In one embodiment, gasket 231 b is embedded in groove 230 c. Groove 230c is formed in flange 230 a of cage 230, as shown in FIG. 8.

In another embodiment, apparatus 200 has cover 214 that simultaneouslyselectively covers the first opening in the single-shell and sealsopening 230 b of cage 230 against the weather and a pressuredifferential. Cover 214 can be of any material having a suitablecombination of thermal properties, corrosion resistance, and strength,for example a formulation of aluminum, bronze, and nickel. In oneembodiment, selective sealing of opening 230 b, using cover 214, isaccomplished by compressing a suitable gasket, such as gasket 231 b thatseals against the weather and a pressure differential, between cover 214and flange 230 a of cage 230. Any suitable method can be used tocompress gasket 231 b between cover 214 and flange 230 a, such as capscrews, a threaded-stud-and-nut arrangement, or the like. Gasket 231 bcan be of any suitable material, such as silicone, rubber, or the like.

In this embodiment, heat sink 231 a is sandwiched between the case andcover 214 to thermally couple them. Heat sink 231 a is any material orcombination of materials having thermal properties suitable for heatsinks, such as aluminum, copper, brass, bronze, or the like. In oneembodiment, a thermal coupling is established between heat sink 231 aand cover 214 while compressing gasket 231 b between cover 214 andflange 230 a, i.e., heat sink 231 a is brought into forced contact withcover 214 and the case using cap screws, a threaded-stud-and-nutarrangement, or the like. In one embodiment, a thermally conductingmaterial is disposed between heat sink 231 a and cover 214 and betweenheat sink 231 a and the case. In another embodiment, heat sink 231 a isbrazed, screwed, bolted, epoxied, using a thermally conductive epoxy, orthe like to the case and cover 214 is brought into forced contact withheat sink 231 a using cap screws, a threaded-stud-and-nut arrangement,or the like, while compressing gasket 231 b between cover 214 and flange230 a. In another embodiment, heat sink 231 a is brazed, screwed,bolted, epoxied, using a thermally conductive epoxy, or the like tocover 214 and is brought into forced contact with the case using capscrews, a threaded-stud-and-nut arrangement, or the like, whilecompressing gasket 231 b between cover 214 and flange 230 a.

In operation, heat sink 231 a absorbs heat dissipated by the objects,e.g. objects 104 of FIG. 2, confined within the case, as follows: theheat dissipated by the objects is transferred to the case via thermalcontact between the objects and the case, and the heat transferred tothe case is absorbed by heat sink 231 a via thermal contact between thecase and heat sink 231 a. The heat absorbed by heat sink 231 a istransferred to cover 214 via thermal contact between heat sink 231 a andcover 214 and is subsequently transferred exteriorly of cover 214.

Apparatus 200 has cover 236. In one embodiment, cover 236 comprises acable head assembly constructed as taught and described in co-pendingapplication Ser. No. 09/804,106 entitled CABLE HEAD ASSEMBLY and filedon even date herewith, which application is incorporated herein byreference.

Cover 236 can be any material having suitable corrosion resistance andstrength, such as nylon, plastic, such as ABS, or structural foam. Cover236 simultaneously covers the second opening in the single-shell andseals the opening framed by flange 230 c of cage 230 against the weatherand a pressure differential. Sealing the opening framed by flange 230 cof cage 230 using cover 236 can be accomplished by compressing asuitable gasket, as demonstrated by gasket 237, between cover 236 andflange 230 c using any suitable method, such as cap screws or athreaded-stud-and-nut arrangement. Gasket 237 can be of the typeemployed by the automotive industry for engine-head gaskets and can beof silicone or a suitable equivalent. In one embodiment, gasket 237 isembedded in cover 236. FIG. 9 is a back view of apparatus 200demonstrating cover 236 simultaneously covering the second opening inthe single-shell and sealing the opening framed by flange 230 c of cage230 against the weather and a pressure differential.

Cover 236 includes lead-out 240 such as for wires used to input andoutput electrical signals to and from the objects. Lead-out 240 can besealed against the weather and a pressure differential using anysuitable material, such as a suitable elastomer.

When cage 230 contains the case containing the objects and including atleast one heat sink protruding through one of its openings 232 and whenopening 230 b and the opening framed by flange 230 c are sealed bycovers 214 and 236, respectively, the objects are sealed against apressure differential and the weather. The sealed case can be fittedwith a pressure-relief valve to guard against excessiveexternal-to-internal pressure differences.

Apparatus 300, shown in FIGS. 10 and 11, demonstrates a third embodimentof the present invention. FIG. 10 demonstrates that apparatus 300 hashousing 302 that can be used for containing objects, such as electroniccircuit cards. Housing 302 includes shell 304 that is sealed against theweather and a pressure differential by a pair of first covers 306 and asecond cover (not shown) opposite first covers 306. Shell 304 can have anumber of fins, as exemplified by fin 307 in FIG. 10, distributed on itsexterior.

Shell 304 includes protrusion 305 on each of its ends having an aperturetherethrough. In another embodiment, protrusion 305 is a lug. A tether305 a passes through the aperture of each protrusion 305 and through anaperture (not shown) in each of covers 306 to form a loop thatinterconnects each protrusion 305 to one of covers 306. Tether 305 a canbe of any material of suitable tensile strength and corrosionresistance, such as an aramid, e.g., Kevlar, or the like. In anotherembodiment, tether 305 a has two ends, and the respective ends of atether 305 a are connected to a cover 306 and an end of shell 304 usingany suitable method, such as screwing, gluing, riveting, or the like.

In particular, as demonstrated in FIG. 11, shell 304 is divided into twocompartments, such as compartment 308, by partition 310. Shell 304 has apair of first apertures, such as aperture 312, one for each compartment.Each aperture 312 is selectively sealed against the weather and apressure differential by one of covers 306. Shell 304 and covers 306 canbe of any material having a suitable combination of thermal properties,corrosion resistance, and strength, for example a formulation ofaluminum, bronze, and nickel, nylon, ABS, or the like.

Selective sealing of the respective apertures, using covers 306, canaccomplished using any suitable method, for example cap screws,nuts-and-bolts, or a combination of threaded studs and nuts, to compressa suitable gasket, such as a gasket that seals against the weather and apressure differential, between the respective cover 306 and shell 304.FIG. 11a illustrates one embodiment of a bottom view of cover 306.Embedded gasket 306 a can be any suitable material that seals againstthe weather and a pressure differential, such as silicone, rubber, orthe like.

Shell 304 has a second aperture opposite covers 306, sealed by thesecond cover against the weather and a pressure differential. The secondcover can include a lead-out. The second cover can be any materialhaving suitable corrosion resistance and strength, such as nylon,plastic, ABS, or structural foam. Sealing of the second aperture usingthe second cover can be accomplished using any suitable sealing method,such as compressing a gasket between the second cover and shell 304. Anysuitable gasket can be used, such as a gasket of type employed by theautomotive industry for engine-head gaskets that can be of silicone oran equivalent material. Compression of the gasket between the secondcover and shell 304 can be accomplished using any suitable method, suchas cap screws, nuts-and-bolts, or a threaded-stud-and-nut arrangement.

The shell 304 has at least one third aperture 314 located in one of thecompartments between and perpendicular to first aperture 312 and thesecond aperture. There can be a pair opposing apertures 314 in eachcompartment, as demonstrated for compartment 308 in FIG. 11, however.The shell also has at least one third cover 316, shown in FIG. 11. Cover316 is adapted to seal aperture 314 against the weather and a pressuredifferential. Cover 316 has a number of fins, as exemplified by fin 307,on its exterior and a heat sink, as exemplified by heat sink 320,thermally coupled to its interior. In one embodiment, heat sink 320 isfunctionally equivalent to heat sink 108 of apparatus 100. In oneembodiment, heat sink 320 can be of the same material as heat sink 108,or a suitable equivalent. Portion 322 of cover 316 can be thermallycoupled to a portion of the shell, as demonstrated in FIG. 11. In theconfiguration where there can be a pair opposing apertures 314 in eachcompartment, each aperture is sealed against the weather and a pressuredifferential by a cover 316, as demonstrated in FIG. 11.

The third embodiment includes at least one case 324, shown in FIG. 11.In one embodiment, case 324 is structurally and functionally equivalentto case 106 of the first embodiment. In one embodiment, case 324 is ofthe same material as case 106, or a suitable equivalent. As demonstratedin FIG. 11, a case 324 can be located in each compartment. When aperture314 is sealed against the weather and a pressure differential by cover316, heat sink 320 extends through aperture 314 and is thermally coupledto case 324.

In an alternative embodiment, the case can be as demonstrated by case400 in FIGS. 12-16. Case 400 is disposed within a housing and is adaptedto confine objects 401, such as electronic circuit cards, at differentlocations within the housing. Case 400 has walls 402 and walls 404 thatconstitute frame 406, demonstrated in FIG. 13. Case 400 has at least onepartition 408 that divides the region within it into at least tworegions. Case 400 has several partitions 410-1 to 410-N and at least onepartition 412 that divide each of the two regions into several sections.Walls 402, walls 404, each of partitions 410-1 to 410-N, and partition408 can be of any material having suitable thermal and strengthproperties, such as aluminum, copper, etc.

Walls 402 are thermally coupled to walls 404. Partitions 410-1 to 410-Nand partition 412 are thermally coupled to walls 404. Partition 408 isthermally coupled to walls 402. Thermal contact can be accomplishedusing any suitable method, such as by polishing or disposing a thermallyconducting material between the contact surfaces and maintaining forcedcontact between the mating surfaces using any suitable method, such asby using a resilient material or by wedging as described below. Thethermally conducting material can be of the type specially manufacturedfor thermal contact situations such as this.

Frame 406 has at least one slot 414 adapted to accommodate partition408. Slot 414 includes a pair of opposing grooves 414 a and b as shown.Frame 406 has several slots 416-1 to 416-M, each adapted to accommodateone of partitions 410-1 to 410-N. Each of slots 416-1 to 416-Mrespectively includes a pair of opposing grooves 416-1 a and 416-1 b to416-Ma to 416-Mb as shown. Frame 406 has at least one slot 418 adaptedto accommodate partition 412. Slot 418 includes a pair of opposinggrooves 418 a and b as shown.

FIG. 14 is an enlarged view of encircled region 14 of FIG. 12 anddemonstrates one embodiment case 400. Partition 410-j of FIG. 14 is anyone of partitions 410-1 to 410-N. Slot 416-k is any one of slots 416-1to 416-M. Slot 416-k is adapted to provide a clearance gap 420-i oneither side of partition 410-j. This demonstrates that each of slots416-1 to 416-M is adapted to provide clearance gap on either of itssides. Partition 412 is composite configuration that includes a pair ofouter layers 422. Outer layers 422 sandwich resilient layer 424 betweenthem. Layers 422 can be of any material having suitable thermal andstrength properties, such as aluminum, copper, etc. Layer 424 can be anymaterial having suitable resilience properties, such as a suitableelastomeric gasket. Slot 418 is adapted to provide a clearance gap 426on either side of partition 412.

Resilient layer 424 exerts a force on each of layers 422, which in turnbear against and transmit the force to adjacent objects 401, asfacilitated by clearance gaps 426. In turn, an object 401 bears againstan adjacent partition 410-j, which transmits the force, as facilitatedby their respective clearance gaps 420-i to the next object 401. Thischain of events continues until the objects 401 that are adjacent one ofwalls 402 are forced against one of walls 402, thus thermally couplingobjects 401 to partition 410-j and 412, to a pair of partitions 410-j,or to a partition 410-j and one of walls 402 and thus securing objects401 within case 400. A thermally conducting material of the typespecially manufactured for thermal contact situations can be deployedbetween the contact surfaces.

FIG. 15 is an enlarged view of encircled region 14 of FIG. 12 anddemonstrates another embodiment of case 400. In one embodiment,partition 510-j is equivalent to partition 410-j of FIG. 14 and is anyone of partitions 410-1 to 410-N of FIG. 12. In one embodiment, slot516-k is equivalent to slot 416-k of FIG. 14 and is any one of slots416-1 to 416-M of FIG. 13. Slot 516-k is adapted to provide a clearancegap 520-i on either side of partition 510-j. In one embodiment, slot520-i is equivalent to slot 420-i of FIG. 14. Partition 512 includes apair of outer layers 522. Layers 522 can be of any material havingsuitable thermal and strength properties, such as aluminum, copper, etc.Wedge 524 is inserted between layers 522, as demonstrated in FIG. 16, atop view of partition 524. Wedge 524 can be any suitable material, e.g.,plastic, aluminum, copper, or the like. In another embodiment, wedge 512is replaced by several wedges positioned one above the other at discretevertical locations between layers 522. Slot 518 is adapted to provide aclearance gap 526 on either side of partition 512.

In one embodiment, wedge 524 exerts a force on each of layers 522, whichin turn bear against and transmit the force to adjacent objects 501, asfacilitated by clearance gaps 526. In one embodiment objects 501 areequivalent to objects 401 in FIG. 14. In turn, an object 501 bearsagainst an adjacent partition 510-j, which transmits the force, asfacilitated by clearance gaps 520-i to the next object 501. This chainof events continues until the objects 501 that are adjacent one of walls402 are forced against one of walls 402, thus thermally coupling objects501 to partition 510-j and 512, to a pair of partitions 510-j, or to apartition 510-j and one of walls 402 and thus securing objects 401within case 400. A thermally conducting material of the type speciallymanufactured for thermal contact situations can be deployed between thecontact surfaces.

In another embodiment of the present invention, each heat sink isconfigured to encapsulate a phase-change material (PCM) that changesfrom a solid to a liquid and vice versa. The PCM can be any suitableliquid-solid PCM, such as paraffin. In another embodiment of the presentinvention each heat sink is configured to encapsulate a PCM that changesfrom a liquid to a vapor and vice versa. The PCM can be any suitableliquid-vapor PCM, such as FLUROINERT, a product of Dow ChemicalCorporation. In another embodiment of the present invention, each heatsink is configured to include at least one heat pipe.

To manufacture apparatus 100, partial-shell 110, including an apertureand a multitude fins on its exterior, as demonstrated by fin 112 in FIG.1, is formed. Cover 114 is formed and used to selectively seal theaperture against the weather and a pressure differential. Base 136having lead-out 140, such as for wiring, is also formed.

Case 106, adapted to confine the objects to different locations withinthe housing, is formed. Forming case 106 involves forming a frame,partition 126, and a plurality of second partitions, demonstrated bypartition 122 in FIG. 2. The region within the frame is divided into tworegions using partition 126, each region is divided into a plurality ofsections, demonstrated by section 124 in FIG. 2, using the plurality ofpartitions 122, and a plurality of slots, demonstrated by slots 128 aand b, is formed in each of the sections 124. Thermal couplings betweeneach of the partitions 122, the frame, and partition 126 are formed.Manufacturing case 106 also involves adapting it to be selectivelyreconfigured between a non-operating configuration, as demonstrated inFIGS. 5 and 6, and an operating configuration, as demonstrated in FIGS.3 and 4.

An object, such as an object 104, is either thermally coupled to one ofwalls 120, partition 126, and a neighboring partition, as exemplified by122 a or to two neighboring partitions, as exemplified by partitions 122b and c, and to partition 126 by first ensuring the case is in thenon-operating configuration. Then, the object is inserted into one ofthe slots, e.g., 128 a or b, and the case is selectively reconfiguredinto the operating configuration. A thermally conducting material of thetype specially manufactured for thermal contact situations can bedeployed between the mating surfaces of the thermal couplings.

At least one heat sink 108 is formed using a solid block of material. Asdemonstrated in FIG. 2, two heat sinks 108 can be formed and thermallycoupled to one of walls 120, respectively.

Manufacturing apparatus 100 includes manufacturing cage 130, positioningcase 106, including at least one heat sink 108 thermally coupled to oneof walls 120, within cage 130 so that at least one heat sink 108protrudes though an opening 132. Cage 130 is attached to base 136. Base136 is attached to partial-shell 110 to seal housing 102 against theweather and a pressure differential. Sealing housing 102 using base 102also includes sealing lead-out 140 of base 136 against the weather and apressure differential.

Manufacturing apparatus 100 includes thermally coupling at least oneheat sink 108 to partial shell 110, thermal coupling accomplished byforming a thermally conducting pad 138 and thermally coupling it to theinterior of partial-shell 110. Thermal coupling between heat sink 108and partial shell 110 is established by bringing heat sink 108 intothermal contact with a corresponding thermally conducting pad 138,accomplished by positioning cage 130 within partial-shell 110.

To manufacture apparatus 200, partial-shells 210 a and b, each having anumber of fins on their respective exteriors, as demonstrated by fins212 a and b, respectively, in FIGS. 7 and 8 are formed. A case that canbe structurally and functionally equivalent to case 106, described abovefor apparatus 100 is formed. At least one heat sink is formed andthermally coupled to the case. As for apparatus 100, two heat sinks canbe coupled to two opposing walls of the case.

Manufacturing apparatus 200 includes forming cage 230 and positioningthe case, including at least one sink thermally coupled thereto, withinit so that at least one heat sink protrudes an opening 232.Manufacturing apparatus 200 includes butting partial-shells 210 a and btogether to form a single-shell about cage 230 that has opposing firstand second openings, respectively comprising openings 210 a 1 and b 1and 210 a 2 and b 2, shown in FIG. 8. The first and second openings arecoincident with opening 230 b and the second opening framed by flange230 c of cage 230, respectively. Butting partial-shells 210 a and btogether can include sealing the abutment against the weather andpressure differential using a suitable material that can also thermallycouple partial-shells 210 a and b.

Cover 214 is formed and is used to selectively simultaneously cover thefirst opening in the single-shell and seal the opening 230 b of the cageagainst the weather and a pressure differential. In another embodiment,gasket 231 a is a heat sink and is used to thermally couple the case tocover 214. Cover 236 having lead-out 240 is formed and is used tosimultaneously close at least a portion of the second opening in thesingle-shell and seal the opening of cage 230 framed by flange 230 cagainst the weather and a pressure differential. Sealing the opening ofcage 230 framed by flange 230 c also involves sealing lead-out 240against the weather and a pressure differential. Sealing opening 230 band the opening framed by flange 230 c of the cage also seals theobjects contained within the case against the weather and a pressuredifferential.

Manufacturing apparatus 200 includes thermally coupling at least oneheat sink to partial-shells 210 a or b. The thermal coupling isaccomplished when partial-shells 210 a and b are butted together to forma single-shell about cage 230, and at least one heat sink protrudesthrough one opening 232 in cage 230 and abuts a corresponding thermallyconducting pad 238. A suitable thermally conducting material can bedeployed between the heat sink and thermally conducting pad 238.

To manufacture apparatus 300, shell 304 is formed. The interior of shell304 so formed is divided into a pair of compartments, such ascompartment 308 in FIG. 11, by partition 310. Shell 304 so formed has apair of first apertures 312 and a second aperture opposite apertures312. Shell 310 so formed has at least one third aperture 314 located inone compartment between and perpendicular to one of apertures 312 andthe second aperture. Shell 304 so formed can have a pair opposingapertures 314 in each compartment, as demonstrated for compartment 308in FIG. 11, however.

At least one case 324 that can be structurally and functionallyequivalent to the case 106 of apparatus 100 is formed. Case 324 ispositioned in the compartment having aperture 314. A pair of firstcovers 306 is formed and each is used to selectively seal one of thefirst apertures 312 against the weather and a pressure differential. Asecond cover having a lead-out for wires is formed and used toselectively seal the second aperture. Sealing the second apertureinvolves sealing the lead-out against the weather and a pressuredifferential.

At least one third cover 316 is formed. Cover 316 so formed has a numberof fins, as demonstrated by fin 307, on its exterior. Third cover 316 isused to seal aperture 314 against the weather and a pressuredifferential. Portion 322 of cover 316 can be thermally coupled to shell304. At least one heat sink 320 is formed and thermally coupled to case324 and the interior of cover 316.

In the configuration, as demonstrated in FIG. 11, where there can be apair opposing apertures 314 in each compartment, a case 324 can belocated in each compartment. In this configuration, each aperture 314 issealed against the weather and a pressure differential by a cover 316. Aheat sink 320 is thermally coupled to the interior of each cover 316 anda case 324. Portion 322 of each cover 316 can be thermally coupled toshell 304.

In another embodiment of the present invention, each heat sink ismanufactured by configuring it to encapsulate a PCM that changes from asolid to a liquid and vice versa. In another embodiment of the presentinvention, each heat sink is manufactured by configuring it toencapsulate a PCM that changes from a liquid to a vapor and vice versa.In another embodiment of the present invention, each heat sink ismanufactured by configuring it to include at least one heat pipe.

CONCLUSION

Embodiments of the present invention have been described. Theembodiments provide a housing adapted to contain objects, for exampleelectronic circuit cards; at least one case located within the housing,the case adapted to confine the objects to different locations withinthe housing, the case also thermally coupled to the objects; and atleast one heat sink adapted to absorb heat from the case, the heat sinkthermally coupled to the case and the housing.

Although specific embodiments have been illustrated and described inthis specification, it will be appreciated by those of ordinary skill inthe art that any arrangement that is calculated to achieve the samepurpose can be substituted for the specific embodiment shown. Thisapplication is intended to cover any adaptations or variations of thepresent invention.

What is claimed is:
 1. An apparatus comprising: a housing adapted tocontain objects; at least one case disposed within the housing, the caseadapted to confine the objects to different locations within thehousing, the case thermally coupled to the objects; at least one heatsink adapted to absorb heat from the case, the heat sink thermallycoupled to the case and the housing; and at least one thermallyconducting pad, the thermally conducting path thermally coupled to aninterior surface of the housing and the heat sink.
 2. The apparatus ofclaim 1, wherein the housing includes a lead-out for wires.
 3. Theapparatus of claim 2, wherein the lead-out is sealed against a pressuredifferential and the weather.
 4. The apparatus of claim 1, wherein theexterior of the housing includes fins.
 5. The apparatus of claim 1,wherein the objects are electronic circuit cards.
 6. The apparatus ofclaim 1 further comprising a pressure-relief valve.
 7. An apparatuscomprising: a housing adapted to contain objects; at least one cagedisposed within the housing, the cage adapted to confine the objects todifferent locations within the housing, the cage thermally coupled tothe objects, the cage having an opening and a flange that extends arounda perimeter of the opening, the flange further having a groove; a coveradapted to selectively cover the opening of the cage; and a seal adaptedto be received in the groove of the flange to provide a seal fromweather and pressure differential when the cover is positioned to coverthe opening of the cage; and at least one heat sink adapted to absorbheat from the case, the heat sink thermally coupled to the case and thehousing.
 8. An apparatus comprising: a housing adapted to containobjects; at least one case disposed within the housing, the case adaptedto confine the objects to different locations within the housing, thecase thermally coupled to the objects; at least one heat sink includinga phase-change material adapted to absorb heat from the case, thephase-change heat sink thermally coupled to the case and the housing;and wherein the phase-change heat sink includes a phase-change materialthat changes from a solid to a liquid and vice versa.
 9. An apparatuscomprising: a housing adapted to contain objects; at least one casedisposed within the housing, the case adapted to confine the objects todifferent locations within the housing, the case thermally coupled tothe objects; at least one heat sink adapted to absorb heat from thecase, the heat sink thermally coupled to the case and the housing,wherein the heat sink comprises at least one heat pipe; and at least onethermally conducting pad, the thermally conducting path thermallycoupled to an interior surface of the housing and the heat sink.
 10. Anapparatus comprising: a housing adapted to contain objects; at least oneframe disposed within the housing, the frame defining anobject-containment volume within the housing, the object-containmentvolume divided into a plurality of sections by a plurality ofpartitions, the partitions thermally coupled to the frame, each of thesections divided into a plurality of slots, each slot having an objectdisposed therein for thermal contact between the partitions and onepartition and the frame, at least one of the partitions selectivelyadapted to be displaced to form a non-operating configuration thatfacilitates the insertion and removal of the objects; and at least oneheat sink adapted to absorb heat from the frame, the heat sink thermallycoupled to the frame and the housing.
 11. The apparatus of claim 10,wherein the heat sink is a solid.
 12. The apparatus of claim 10, whereinthe heat sink comprises a phase-change material.
 13. The apparatus ofclaim 12, wherein the phase change material changes from a solid to aliquid and vice versa.
 14. The apparatus of claim 12, wherein the phasechange material changes from a liquid to a vapor and vice versa.
 15. Theapparatus of claim 10, wherein the heat sink comprises at least one heatpipe.
 16. An apparatus comprising: a base; a partial-shell having anaperture therein, the partial-shell attached to the base, whereby thebase and partial-shell define a housing adapted to contain objects, thehousing having an aperture; a cover adapted to close the housing bycovering the aperture; a frame disposed in the housing, the framedefining an object containment volume within the housing, the objectcontainment volume divided into two regions by a first partition, eachof the two regions divided into a plurality of sections by a pluralityof second partitions, each of the second partitions thermally coupled tothe frame and the first partition, each of the sections divided into aplurality of slots, each slot having an object disposed therein forthermal contact between the first partition, a second partition, and oneof a second partition and the frame; at least one heat sink adapted toabsorb heat from the frame, the heat sink thermally coupled to the frameand the partial-shell; and a cage attached to the base, the cage adaptedto confine the frame, including the heat sink thermally coupled thereto,to the base so that the heat sink extends through the cage, whereby whenthe partial-shell is attached to the base, the heat sink is thermallycoupled to the partial-shell.
 17. The apparatus of claim 16, wherein theexterior of the partial-shell includes fins.
 18. The apparatus of claim16, wherein the base seals against the partial-shell to seal the housingagainst a pressure differential and the weather.
 19. The apparatus ofclaim 16, wherein the base includes a lead-out for wires.
 20. Theapparatus of claim 19, wherein the lead-out is sealed against a pressuredifferential and the weather.
 21. The apparatus of claim 16, wherein thecover selectively seals the aperture against a pressure differential andthe weather.
 22. The apparatus of claim 16, wherein at least one of thesecond partitions comprises two outer layers that sandwich a resilientlayer therebetween.
 23. The apparatus of claim 16, wherein at least oneof the second partitions comprises two outer layers having at least onewedge therebetween.
 24. The apparatus of claim 16, wherein the frame isadapted to selective reconfiguration between operating and non-operatingconfigurations, the non-operating configuration comprises the secondpartitions of one of the regions being displaced relative to the secondpartitions of the other region, and the operating configurationcomprises the second partitions of one of the regions being aligned withthe second partitions of the other region.
 25. An apparatus comprising:a cage having continuous opposing first and second openings; a framedisposed within the cage, the region within the frame divided into tworegions by a first partition, each of the two regions divided into aplurality of sections by a plurality of second partitions, each of thesecond partitions thermally coupled to the frame and the firstpartition, each of the sections divided into a plurality of slots, eachslot having an object disposed therein for thermal contact between thefirst partition, a second partition, and one of a second partition andthe frame; at least one heat sink adapted to absorb heat from the frame,the heat sink thermally coupled to the frame, as disposed within thecage, the heat sink protruding through the cage; a pair ofpartial-shells, the partial shells mated together to form a single-shellabout the cage so that at least one heat sink, protruding through thecage, is thermally coupled to at least one of the partial-shells, thesingle-shell so formed having first and second openings, the firstopening of the single-shell coincident with first opening of the cageand at least a portion of the second opening of the single-shellcoincident with the second opening of the cage; a first cover adapted tosimultaneously selectively cover the first opening of the single shelland seal the first opening of the cage against the weather and apressure differential; and a second cover adapted to simultaneouslycover at least a portion of the second opening of the single-shell andseal the second opening of the cage against the weather and a pressuredifferential.
 26. The apparatus of claim 25, wherein each of the partialshells includes fins on their respective exteriors.
 27. The apparatus ofclaim 25, wherein the second cover includes a lead-out for electricalwires.
 28. The apparatus of claim 27, wherein the lead-out is sealedagainst a pressure differential and the weather.
 29. The apparatus ofclaim 25, wherein at least one of the second partitions comprises twoouter layers that sandwich a resilient layer therebetween.
 30. Theapparatus of claim 25, wherein at least one of the second partitionscomprises two outer layers having at least one wedge therebetween. 31.The apparatus of claim 25, wherein the frame is adapted to selectivereconfiguration between operating and non-operating configurations, thenon-operating configuration comprises the second partitions of one ofthe regions being displaced relative to the second partitions of theother region, and the operating configuration comprises the secondpartitions of one of the regions being aligned with the secondpartitions of the other region.
 32. The apparatus of claim 25, furthercomprising at least one heat sink adapted to thermally couple the frameto the first cover.
 33. An apparatus comprising: a shell, the interiorof the shell divided into two compartments by a first partition, theshell having a pair of adjacent first apertures in the same plane, onefirst aperture for each compartment, the shell having a second apertureopposite the first apertures, the shell having at least one thirdaperture, the third aperture in one of the compartments between andperpendicular to one of the first apertures and the second aperture; apair of first covers, each adapted to selectively seal one of the firstapertures against the weather and a pressure differential; a secondcover adapted to seal the second aperture against the weather and apressure differential; at least one third cover adapted to seal thethird aperture against the weather and a pressure differential; at leastone frame, the frame disposed in one of the compartments, the framedivided into two regions by a second partition, each of the two regionsdivided into a plurality of sections by a plurality of third partitions,each of the third partitions thermally coupled to the frame and thesecond partition, each of the sections divided into a plurality ofslots, each slot having an object disposed therein for thermal contactbetween the second partition, a third partition, and one of a thirdpartition and the frame; and at least one heat sink thermally coupled tothe frame and the third cover, the heat sink adapted to absorb heat fromthe frame.
 34. The apparatus of claim 33, wherein the third coverincludes fins on its exterior.
 35. The apparatus of claim 33, whereinthe second cover includes a lead-out for wires.
 36. The apparatus ofclaim 35, wherein the lead-out is sealed against a pressure differentialand the weather.
 37. The apparatus of claim 33, wherein at least one ofthe second partitions comprises two outer layers that sandwich aresilient layer therebetween.
 38. The apparatus of claim 33, wherein atleast one of the second partitions comprises two outer layers having atleast one wedge therebetween.
 39. The apparatus of claim 33, wherein theframe adapted to selective reconfiguration between operating andnon-operating configurations, the non-operating configuration comprisesthe third partitions of one of the regions being displaced relative tothe third partitions of the other region, and the operatingconfiguration comprises the third partitions of one of the regions beingaligned with the third partitions of the other region.
 40. The apparatusof claim 33, further comprising a pair of tethers, each interconnectingone of the pair of first covers to the shell.
 41. The apparatus of claim40, wherein each tether is nonmetallic.
 42. A method for manufacturingan apparatus for containing objects, the method comprising: forming ahousing; forming at least one case adapted to confine the objects todifferent locations within the housing; forming at least one heat sinkadapted to absorb heat from the case; forming a thermal coupling betweenthe objects and the case; forming a thermal coupling between the caseand the heat sink; disposing the case, as thermally coupled to theobjects and the heat sink, within the housing; forming a thermalcoupling between the heat sink, as thermally coupled to the case, andthe housing; and disposing a thermally conducting pad between the heatsink and an internal surface of the housing.
 43. The method of claim 42,wherein forming the housing includes providing a lead-out in the housingfor wires.
 44. The method of claim 43, further comprising sealing thelead-out so that the housing is sealed against the weather and apressure differential.
 45. The method of claim 42, wherein forming thehousing includes forming fins on the exterior of the housing.
 46. Themethod of claim 42, wherein forming the heat sink includes using a solidfor the heat sink.
 47. The method of claim 42, wherein forming the heatsink includes using a phase-change material for the heat sink.
 48. Themethod of claim 47, wherein using a phase-change material for the heatsink includes using a phase-change material that changes from a solid toa liquid and vice versa.
 49. The method of claim 47, wherein using aphase-change material for the heat sink includes using a phase-changematerial that changes from a liquid to a vapor and vice versa.
 50. Themethod of claim 42, wherein forming the heat sink includes using atleast one heat pipe for the heat sink.
 51. A method for manufacturing anapparatus for containing objects, the method comprising: forming ahousing; forming at least one frame, the frame defining anobject-containing volume within the housing; partitioning theobject-containing volume into plurality of sections using a plurality ofpartitions; forming a thermal coupling between each of the partitionsand the frame; forming a plurality of slots in each of the sections;displacing one or more of the partitions with respect to the remainingpartitions to place the frame in a non-operating configuration to alloweasy access to the slots; inserting the objects into the slots;repositioning the one or more partitions that were displaced during inthe non-operating configuration once the objects are inserted in theslot to place the frame in an operating configuration; forming a thermalcoupling between the objects and the partitions and the partitions theframe; forming at least one heat sink adapted to absorb heat from theframe; forming a thermal coupling between the frame and the heat sink;disposing the frame, as thermally coupled to the objects and the andheat sink, within the housing; and forming a thermal coupling betweenthe heat sink, as thermally coupled to the frame, and the housing.
 52. Amethod for manufacturing an apparatus for containing objects, the methodcomprising: forming a partial-shell; forming an aperture in thepartial-shell; forming fins on the exterior of the partial-shell;forming a base; forming a cover; using the cover to selectively seal theaperture against the a pressure differential and the weather; forming aframe; forming a first partition; dividing the region within the frameinto two regions using the first partition; forming a plurality ofsecond partitions; dividing each of the two regions into a plurality ofsections using the plurality of second partitions; forming a thermalcoupling between each of the partitions and the frame and the firstpartition; forming a plurality of slots in each of the sections;inserting the objects into the slots; forming a thermal coupling betweenthe objects and the first partition, a second partition, and one of asecond partition and the frame; forming at least one heat sink adaptedto absorb heat from the frame; forming a thermal coupling between theframe and the heat sink; disposing the frame, as thermally coupled tothe objects and the and heat sink, within the partial shell; forming athermal coupling between the heat sink, as thermally coupled to theframe, and the partial-shell; and using the base to seal thepartial-shell, as thermally coupled to the heat sink.
 53. The method ofclaim 52, wherein disposing the frame within the partial-shellcomprises: forming a cage; disposing the frame within a cage so that theheat sink protrudes an opening in the cage; and attaching the cage tothe base.
 54. The method of claim 52, wherein forming the base includesforming a lead-out for wires in the base.
 55. The method of claim 54,wherein using the base to seal the partial-shell includes sealing thelead-out.
 56. The method of claim 52 wherein forming the secondpartitions includes forming at least one of the second partitions byforming a pair of outer layers and disposing a layer of resilientmaterial between the outer layers.
 57. The method of claim 52 whereinforming the second partitions includes forming at least one of thesecond partitions by forming a pair of outer layers and inserting atleast one wedge between the outer layers.
 58. The method of claim 52further comprising adapting the frame to be selectively reconfiguredbetween a non-operating configuration and an operating configuration,wherein the non-operating configuration comprises the second partitionsof one the regions being displaced relative to the second partitions ofthe other region, wherein the operating configuration comprises thesecond partitions of one of regions being aligned with the secondpartitions of the other region.
 59. The method of claim 58, whereininserting the objects into the slots comprises inserting the objectsinto the slots while the frame is in the non-operating configuration.60. The method of claim 59, wherein forming a thermal coupling betweenthe objects and the first partition, a second partition, and one of asecond partition and the frame is accomplished by reconfiguring theframe to the operating configuration.
 61. A method for manufacturing anapparatus for containing objects, the method comprising: forming a pairof partial-shells; forming fins on each of the partial-shells; forming acage having continuous opposing first and second openings; forming aframe; forming a first partition; dividing the region within the frameinto two regions using the first partition; forming a plurality ofsecond partitions; dividing each of the two regions into a plurality ofsections using the plurality of second partitions; forming a thermalcoupling between each of the partitions and the frame and the firstpartition; forming a plurality of slots in each of the sections;inserting the objects into the slots; forming a thermal coupling betweenthe objects the first partition, a second partition, and one of a secondpartition and the frame; forming at least one heat sink adapted toabsorb heat from the frame; forming a thermal coupling between the frameand the heat sink; disposing the frame containing the objects and havingat least one heat sink coupled thereto, within the cage so the heat sinkprotrudes through the cage; abutting the partial-shells to form asingle-shell, having opposing first and second openings, around the cageso the first opening of the cage coincides with the first opening of thesingle-shell, the second opening of the cage coincides with at least aportion of the second opening of the single shell, and at least one heatsink protruding through the cage is thermally coupled to one of thepartial shells; forming a first cover; using the first cover tosimultaneously selectively cover the first opening of the single-shelland seal the first opening of the cage against the a pressuredifferential and the weather; forming a second cover; and using thesecond cover to simultaneously cover a portion of the second opening ofthe single-shell and seal the second opening of the cage against theweather.
 62. The method of claim 61, wherein forming the second coverincludes forming a lead-out for wires in the second cover.
 63. Themethod of claim 62, wherein using the second cover to seal thepartial-shell includes sealing the lead-out.
 64. The method of claim 61,wherein abutting the partial shells comprises forming a thermal couplingbetween the shells.
 65. The method of claim 61, wherein abutting thepartial shells comprises sealing the abutment against the weather and apressure differential.
 66. The method of claim 61 wherein forming thesecond partitions includes forming at least one of the second partitionsby forming a pair of outer layers and disposing a layer of resilientmaterial between the outer layers.
 67. The method of claim 61 whereinforming the second partitions includes forming at least one of thesecond partitions by forming a pair of outer layers and inserting atleast one wedge between the outer layers.
 68. The method of claim 61further comprising adapting the frame to be selectively reconfiguredbetween a non-operating configuration and an operating configuration,wherein the non-operating configuration comprises the second partitionsof one the regions being displaced relative to the second partitions ofthe other region, wherein the operating configuration comprises thesecond partitions of one of regions being aligned with the secondpartitions of the other region.
 69. The method of claim 68, whereininserting the objects into the slots comprises inserting the objectsinto the slots while the frame is in the non-operating configuration.70. The method of claim 69, wherein forming a thermal coupling betweenthe objects and the first partition, a second partition, and one of asecond partition and the frame is accomplished by reconfiguring theframe to the operating configuration.
 71. The method of claim 61,wherein forming at least one heat sink includes forming at least twoheat sinks.
 72. The method of claim 71, wherein forming the thermalcoupling between the frame and the heat sink includes forming a thermalcoupling between the frame and the at least two heat sinks.
 73. Themethod of claim 72, further comprising forming a thermal couplingbetween at least one of the at least two heat sinks and the first cover.74. A method for manufacturing an apparatus for containing objects, themethod comprising: forming a shell; forming a first partition to dividethe interior of the shell into two compartments; forming an pairadjacent first apertures in the shell, one first aperture for eachcompartment; forming a second aperture in the shell opposite the firstapertures; forming at least one third aperture in the shell between andperpendicular to one of the first apertures and the second aperture, thethird aperture opening into one of the compartments; forming a pair offirst covers; using each of the first covers to selectively seal each ofthe first apertures against a pressure differential and the weather;forming at least one frame; forming a second partition; dividing theregion within the frame into two regions using the second partition;forming a plurality of third partitions; dividing each of the tworegions of the frame into a plurality of sections using the plurality ofthird partitions; forming a thermal coupling between each of the thirdpartitions and the frame and the second partition; forming a pluralityof slots in each of the sections of the frame; inserting the objectsinto the slots; forming a thermal coupling between the objects and thesecond partition, a third partition, and one of a third partition andthe frame; forming a second cover; forming at least one third cover;forming fins on the exterior of the third cover; disposing frame, asthermally coupled to the objects, within one of the compartments;forming at least one heat sink, the heat sink adapted to absorb heatfrom the frame; forming a thermal coupling between interior the thirdcover and the heat sink; forming a thermal coupling between the heatsink and the frame; using the third cover to seal the third apertureagainst the weather and a pressure differential; and using the secondcover to seal the second aperture against the weather and a pressuredifferential.
 75. The method of claim 74, wherein forming the secondcover includes forming a lead-out for wires in the second cover.
 76. Themethod of claim 75, wherein using the second cover to seal the shellincludes sealing the lead-out.
 77. The method of claim 74 whereinforming the second partitions includes forming at least one of thesecond partitions by forming a pair of outer layers and disposing alayer of resilient material between the outer layers.
 78. The method ofclaim 74 wherein forming the second partitions includes forming at leastone of the second partitions by forming a pair of outer layers andinserting at least one wedge between the outer layers.
 79. The method ofclaim 74 further comprising adapting the frame to be selectivelyreconfigured between a non-operating configuration and an operatingconfiguration, wherein the non-operating configuration comprises thethird partitions of one the regions being displaced relative to thethird partitions of the other region, wherein the operatingconfiguration comprises the third partitions of one of regions beingaligned with the third partitions of the other region.
 80. The method ofclaim 79, wherein inserting the objects into the slots comprisesinserting the objects into the slots while the frame is in thenon-operating configuration.
 81. The method of claim 80, wherein forminga thermal coupling between the objects and the second partition, a thirdpartition, and one of a third partition and the frame is accomplished byreconfiguring the frame to the operating configuration.
 82. The methodof claim 74, further comprising connecting each of the pair of firstcovers to the shell using each of a pair of tethers, respectively. 83.The method of claim 82, wherein connecting each of the pair of firstcovers to the shell using each of a pair of tethers, respectively,includes using tethers of a nonmetallic material.
 84. A method forreducing the temperature in a housing containing an array ofheat-dissipating objects, the method comprising: forming at least onecase adapted to confine the objects to different locations within thehousing; forming at least one heat sink adapted to absorb heat from thecase; forming a thermal coupling between the case and the heat sink;disposing the case, as thermally coupled to the objects and the heatsink, within the housing; and forming a thermal coupling between theheat sink, as thermally coupled to the case, and the housing.
 85. Themethod of claim 84, wherein forming the case comprises: forming a frame;forming a first partition; dividing the region within the frame into tworegions using the first partition; forming a plurality of secondpartitions; dividing each of the two regions into a plurality ofsections using the plurality of second partitions; forming a thermalcoupling between each of the partitions and the frame and the firstpartition; forming a plurality of slots in each of the sections;inserting the objects into the; and forming a thermal coupling betweenthe objects and the first partition, a second partition, and one of asecond partition and the frame.
 86. The method of claim 84, whereinforming the heat sink includes using a solid for the heat sink.
 87. Themethod of claim 84, wherein forming the heat sink includes using aphase-change material for the heat sink.
 88. The method of claim 87,wherein using a phase-change material for the heat sink includes using aphase-change material that changes from a solid to a liquid and viceversa.
 89. The method of claim 88, wherein using a phase-change materialfor the heat sink includes using a phase-change material that changesfrom a liquid to a vapor and vice versa.
 90. The method of claim 84,wherein forming the heat sink includes using at least one heat pipe forthe heat sink.
 91. The method of claim 85, wherein forming the secondpartitions includes forming at least one of the second partitions byforming a pair of outer layers and disposing a layer of resilientmaterial between the outer layers.
 92. The method of claim 85 whereinforming the second partitions includes forming at least one of thesecond partitions by forming a pair of outer layers and inserting atleast one wedge between the outer layers.
 93. The method of claim 85further comprising adapting the frame to be selectively reconfiguredbetween a non-operating configuration and an operating configuration,wherein the non-operating configuration comprises the second partitionsof one the regions being displaced relative to the second partitions ofthe other region, wherein the operating configuration comprises thesecond partitions of one of regions being aligned with the secondpartitions of the other region.
 94. The method of claim 93, whereininserting the objects into the slots comprises inserting the objectsinto the slots while the frame is in the non-operating configuration.95. The method of claim 94, wherein forming a thermal coupling betweenthe objects and the first partition, a second partition, and one of asecond partition and the frame is accomplished by reconfiguring theframe to the operating configuration.
 96. The apparatus of claim 1, theheat sink further comprising: a contact surface adapted to abut thethermally conductive pad to form the thermal coupling.
 97. The apparatusof claim 1, wherein the contact surface is polished to enhance thermalcoupling.
 98. The apparatus of claim 1, wherein the material of thecontact pad is made from a group comprising aluminum and copper.
 99. Theapparatus of claim 1, wherein the thermally conductive pad is thermallycoupled to the inside surface of the housing by one selected from agroup comprising molding, brazing, thermally conductive epoxy andscrewing.
 100. The apparatus of claim 1, wherein the inside surface ofthe housing is polished to enhance thermal coupling.
 101. The apparatusof claim 10, wherein the at least one of the partitions is displaced inrelation to another of the partitions.
 102. The apparatus of claim 10,wherein the frame comprises two or more walls, wherein at least one ofthe two or more walls is adapted to be selectively displaced to form anon-operating configuration that facilitates the insertion and removalof the objects.
 103. The apparatus of claim 102, wherein the at leastone of the two or more walls is adapted to be selectively displaced withrelation to another of the one of the two or more walls.
 104. Theapparatus of claim 42, wherein the thermally conductive pad is thermallycoupled to the inside surface of the housing by the method selected froma group comprising molding, brazing, thermally conductive epoxy andscrewing.
 105. The method of claim 51, wherein the frame has two or moreframe walls, the method further comprising: displacing at least one offrame walls in relation to another of the frame walls when the frame isin the non-operating configuration.
 106. A housing apparatus comprising:a shell adapted to receive a case in an internal compartment; and a heatsink having a first end adapted to protrude through an aperture in theshell, the first end of the heat sink is further adapted to be in directthermal contact with the case through the aperture in the shell. 107.The housing apparatus of claim 106, further comprising: a case coveradapted to seal an opening in the shell to the internal compartment fromweather and pressure differential.
 108. The housing apparatus of claim106, wherein the case is thermally coupled to the shell.
 109. Thehousing apparatus of claim 106, further comprising: a cover thermallycoupled to a second end of the heat sink.
 110. The housing apparatus ofclaim 109, further comprising:: fins thermally coupled to the cover.111. The housing apparatus of claim 109, wherein the cover is adapted toseal the aperture in the shell from weather and pressure differential.112. The housing apparatus of claim 109, wherein at least a portion ofthe cover is thermally coupled to the shell.
 113. The housing apparatusof claim 106, wherein the case is adapted to confine electronic circuitcards to different locations within the case.
 114. The housing apparatusof claim 113, wherein the electronic cards are thermally connected tothe case.
 115. The housing apparatus of claim 106, wherein the heatsinks is configured to encapsulate phase-change material to absorb heat.116. The housing apparatus of claim 115, wherein the phase-changematerial changes from a solid to a liquid and vice versa.
 117. Thehousing apparatus of claim 115, wherein the phase-change materialchanges from a liquid to a vapor and vice versa.
 118. A housingapparatus comprising: a shell having an outside surface and at least oneinternal compartment, the internal compartment having an access apertureto the outside surface, the shell further having at least one heat sinkaperture also extending from the surface of the shell into the at leastone internal compartment; a case for each internal compartment, eachcase is adapted to be received in an associated internal compartmentthrough the associated access aperture; one or more covers having afirst surface, the first surface of each cover having a portion adaptedto abut a portion of the outside surface of the shell; and one or moreheat sinks for each cover, each heat sink being thermally coupled to aportion of the first surface of an associated cover, one of the one ormore heat sinks being adapted to extend through an associated heat sinkaperture to form a thermal couple with an associated case in anassociated internal compartment of the shell when the associated coverabuts the outside surface of the shell.
 119. The housing apparatus ofclaim 118, wherein each case is thermally coupled to the shell when itis received in its associated internal compartment.
 120. The housingapparatus of claim 118, further comprising: a case cover for eachinternal compartment, each case cover adapted to seal an associatedaccess aperture from weather and pressure differentials.
 121. Thehousing apparatus of claim 118, wherein each cover is adapted to seal anassociated access aperture from weather and pressure differentials. 122.The housing apparatus of claim 118, wherein each cover further includesa second surface positioned opposite the first surface, each coverfurther comprising: a plurality of fins thermally coupled to the secondsurface of the cover.
 123. The housing apparatus of claim 118, whereinthe case is adapted to confine objects to different locations within thecase.
 124. The housing apparatus of claim 123, wherein the case isthermally coupled to at least one of the objects.
 125. The housingapparatus of claim 123, wherein the objects are electronic circuitcards.
 126. The housing apparatus of claim 118, wherein at least one ofthe heat sinks is configured to encapsulate phase-change material toabsorb heat.
 127. The housing apparatus of claim 126, wherein thephase-change material changes from a solid to a liquid and vice versa.128. The housing apparatus of claim 126, wherein the phase-changematerial changes from a liquid to a vapor and vice versa.
 129. A housingapparatus comprising: a shell having a first end and a second endpositioned opposite the first end, the shell further having one or moresidewalls extending between the first end and the second end, the shellhaving at least one compartment that extends into the first end, theshell further having at least heat sink one aperture for eachcompartment, each heat sink aperture extending from an outside surfaceof one of the one or more sidewalls into an associated compartment inthe shell; a case for each compartment, each case being adapted to bethermally coupled in an associated compartment; one or more covers, eachcover having a first surface, at least a portion of the first surface ofeach cover being adapted to abut a portion of the outside surface of theone or more sidewalls of the shell; and one or more heat sinks for eachcover, each heat sink being thermally coupled to a portion of the firstsurface of an associated cover, at least one of the one or more heatsinks being adapted to extend through an associated heat sink aperturewhen the portion of the first surface of its associated cover abuts theportion of the outside surface of the one of the one or more sidewallsof the shell to form a thermal couple between the at least one of theone or more heat sinks and an associated case to provide a heat transferpath.
 130. The housing apparatus of claim 129, wherein each of thecovers further include a second surface opposite the first surface, eachcover further comprising: a plurality of fins thermally coupled to thesecond surface of the cover.
 131. The housing apparatus of claim 129,wherein each cover is further adapted to seal an associated heat sinkaperture against a pressure differential and the weather.
 132. Thehousing apparatus of claim 129, further comprising: a case cover foreach case, each case cover adapted to seal an associated case fromweather and pressure differential.
 133. The housing apparatus of claim129, wherein at least one of the heat sinks is configured to encapsulatephase-change material to absorb heat.
 134. The housing apparatus ofclaim 133, wherein the phase-change material changes from a solid to aliquid and vice versa.
 135. The housing apparatus of claim 133, whereinthe phase-change material changes from a liquid to a vapor and viceversa.
 136. The housing apparatus of claim 129, wherein the case isadapted to confine objects to different locations within the case, thecase further being thermally coupled to the objects.
 137. The housingapparatus of claim 136, wherein the objects are electronic circuitcards.